VIS and NXP open Singapore 12-inch fab as VSMC studies a second plant

Vanguard International Semiconductor (VIS) and NXP Semiconductors have opened VSMC’s first 12-inch wafer fab in Singapore, marking a major step for the joint venture and for VIS’s move from 8-inch into 12-inch foundry manufacturing. The plant officially held its opening ceremony on Sept. 28, 2026, after roughly 22 months of construction from groundbreaking in December 2024. Total investment in the first fab reached $7.8 billion, with planned monthly capacity of 44,000 wafers. The project also highlights the overseas deployment of Taiwan’s semiconductor factory engineering ecosystem. Taiwan Semiconductor Manufacturing Co. (TSMC), a shareholder in VIS, provided technology licensing and facility manpower support, while Taiwanese engineering suppliers including Marketech International, CTCI Advanced Systems, United Integrated Services, and L&K Engineering participated in automation, facility systems, specialty gas and chemical supply, cleanroom work, and electromechanical contracting. According to Bloomberg, the fab will focus on specialty process technologies from 40 nm to 130 nm, covering mixed-signal, power management, and embedded flash applications for automotive and industrial uses. NXP CEO Rafael Sotomayor said the investment is the company’s largest since its 2015 acquisition of Freescale and is intended to support hardware demand tied to "Physical AI" at the edge, including automotive and infrastructure applications. VIS Chairman Fang Leuh said chip shortages are likely to persist for some time and confirmed the company is evaluating the possibility of building a second fab in Singapore, though no capital spending figure has been disclosed.